聯亞國際科技股份有限公司

Products電纜組裝Micro SD card, push-push

Micro SD card, push-push

Material:
Housing: High temperature thermoplastic
Cover: Copper alloy or steel
Contact: Copper alloy
Plating:
Under plate: Nickel
Contact area: Gold over nickel
Solder area: Tin over nickel

With our innovative design and manufacturing capabilities, we can deliver a total solution from start to finish Most significantly of all, with our quality cost control methods and years of manufacturing experience, we are confident that Asialink is your first choice for partnership.




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