CF 50 pin CONNECTOR

AsiaLink provides premium interconnect solutions with a focus on high-reliability Terminal Plating technology. Our connectors are engineered to provide superior electrical conductivity and exceptional corrosion resistance, making them ideal for telecommunications, industrial control, and automotive electronics.

Advanced Plating & Material Features

• Precision Terminal Plating:
  We offer high-performance surface treatments, including Full Gold Plating, Selective Gold Plating (Flash to 30u"), and Tin Plating to meet specific application requirements for conductivity and cost-effectiveness.
• Multi-Layer Underplating:
  All terminals feature a high-quality Nickel underplate to prevent base metal migration and enhance the durability of the final gold or tin finish.
• Superior Contact Reliability:
  Engineered to minimize contact resistance and prevent oxidation, ensuring stable signal and power transmission even in humid or harsh environments.
• High-Temperature Housing:
  Utilizing UL 94 V-0 rated thermoplastics (LCP/ PBT/ Nylon) that withstand high-heat reflow soldering without deforming.
• Robust Solderability:
  Our plating processes are optimized for excellent solder wetting, reducing defect rates during SMT or wave soldering production.

General Technical Specifications

• Terminal Base Material: Copper Alloy (Brass/ Phosphor Bronze)
• Plating Options:
  • Mating Area: Gold Plating (u" thickness customizable)
  • Solder Tail: Matte Tin or Gold Flash
  • Underplate: Nickel overall (50u" - 100u")
• Current Rating: 0A – 5.0A
• Contact Resistance: 20 mΩ – 40 mΩ
• Insulation Resistance: 1,000M Omega
• Durability: 5,000 to 10,000+ Mating Cycles (depending on plating thickness)

Target Applications

• Industrial: PLC controllers, sensors, and robotics.
• Telecom: High-speed routers, switches, and telecom jacks.
• Consumer: Handheld devices, wearables, and smart home appliances.
• Automotive: Diagnostic interfaces and infotainment systems.