Industrial X-Ray Inspection System (NDT Equipment)

To ensure the highest quality and reliability for high-density PCBAs, custom wire harnesses, and overmolded assemblies, our facility is equipped with an advanced Industrial-Grade X-Ray Inspection System. Utilizing high-resolution X-ray imaging, we perform comprehensive Non-Destructive Testing (NDT) on internal structures to strictly control quality before shipment.

1. Key Inspection Capabilities:

• High-Density PCBA Solder Joint Inspection:
Clear X-ray visualization allows precise inspection of multi-layer PCBs, BGA solder balls, IC packaging, and vias. It effectively detects hidden defects such as voiding, cold solder joints, air bubbles, and bridging/short circuits that are invisible to the naked eye.

• Wire Harness & Terminal Structure Inspection:
Non-destructively inspects the internal wiring layout and terminal soldering quality of multi-core communication and waterproof cables without damaging the outer insulation, eliminating potential internal short circuits.

• Overmolding Quality Control:
Inspects inside overmolded components for air bubbles, voiding, material shortage, or internal component displacement caused during the injection molding process.

2. Technical Specifications & Applications:

• Inspection Method: Non-Destructive Testing (NDT)
• Target Applications: High-spec communication cable assemblies, smart device control cables, medical & industrial wire harnesses, and precision PCBA modules.